Electronic Engineering Department, The Chinese University of Hong Kong - ELEG5762 - 類腦計算硬件設計:從材料、器件到電路實現類腦計算

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The Master of Science Programme in Microelectronics and Integrated Circuits is designed to provide a comprehensive and rigorous foundation in both microelectronics and integrated circuit engineering. By integrating core knowledge in electronic device design, chip architecture, design automation, fabrication techniques, packaging, and testing, the Programme seeks to train graduates who are proficient in every stage of the IC development lifecycle. Students will explore the fundamental scientific principles underpinning these technologies, preparing them for leadership in both academic research and cutting-edge industrial applications.

Students will also gain hands-on experience through laboratories and industry partnerships. The Programme emphasizes both academic rigor and practical skills, ensuring that graduates are well-prepared to meet the challenges of the rapidly evolving semiconductor industry.

Upon completing this Programme, students will have acquired:

  1. Comprehensive knowledge of semiconductor physics, electronic devices, and integrated circuits, enabling them to understand and analyse the fundamental principles underlying modern microelectronics systems.
  2. Proficiency in using key methodologies, tools, and techniques for electronic device design, chip design, design automation, fabrication, packaging, and testing, including the ability to work with industry-standard software and hardware tools.
  3. The ability to develop and implement innovative solutions to complex problems in microelectronics, leveraging both theoretical and practical knowledge in device design, circuit design, and system integration.
  4. Skills in optimization and automation of electronic design processes, including the use of design automation tools (EDA), simulation, and verification techniques to improve efficiency and accuracy in microelectronic system development.
  5. A deep understanding of fabrication processes and packaging technologies, including knowledge of cutting-edge semiconductor manufacturing techniques, materials, and the integration of components into functional systems.
  6. Effective communication and teamwork skills, with the ability to collaborate in multidisciplinary teams, present technical information clearly, and engage in professional discussions, both orally and in writing.
  7. An understanding of professional ethics and the societal impact of microelectronics technologies, including knowledge of sustainability, safety standards, intellectual property, and the ethical implications of design choices.

Entry Requirements

In addition to the general requirements of the Graduate School, applicants should preferably have obtained a Bachelor's degree from a recognized university, or equivalent professional qualifications in Microelectronics, Electrical Engineering, Electronic Engineering, Information Engineering, Telecommunications Engineering or other related fields.

The entrance requirements of the graduate school:

Master's programme:

  • graduated from a recognized university and obtained a bachelor’s degree, normally with honours not lower than Second Class or achieving an average grade of not lower than “B”; or
  • completed a course of study in a tertiary educational institution and obtained professional or similar qualifications equivalent to a bachelor’s degree. 

Notes on English Proficiency:

  • All students should fulfil the English Language Proficiency Requirement prescribed by Graduate School before they are admitted.

(Reference: Admissions Requirements)

 We also welcome non-local applicants. All admitted non-local students must obtain a student visa or entry permit for entering Hong Kong for the purpose of education.


Tuition Fee

2026-2027 academic year

  • Full Time mode: HK$260,000 for the whole programme (including 8 courses), HK$10,833 per unit.
  • Part Time mode: HK$260,000 for the whole programme (including 8 courses), HK$10,833 per unit.

Payment:

  • Full-time mode: paid by 2 installments (12 units per installment)
  • Part-time mode: 6 units (1st installment). Future installments will be paid in terms of the number of courses taken by the student.

Successful applicants who accept an offer from the program are required to pay a non-refundable deposit (1st installment of tuition fee) to confirm their acceptance of admission offer within 2 weeks after the official offer letter is released.


Application Procedures

Applications will be processed on a rolling basis until all places have been filled. Therefore, early applications are strongly encouraged.

Application deadline for 2026 Entry: 1st Round: 24 November 2025 (Mon)
  2nd Round: 12 January 2026 (Mon)
  3rd Round: 16 March 2026 (Mon)

Early application is strongly recommended.

*Please refer to this webpage for the latest application deadline.


How to apply: Applicants should

  1. submit application via the Online Application System (MSc in Microelectronics and Integrated Circuits );
  2. upload scanned copies of all the required documentary proof to the Online Application System
    **For details of required documents, please visit Documents Required; and

Applicants must upload the scanned copy of transcript and other supporting documents to the application system for review. Otherwise, the applications may not be further processed. Hard copies are not required during the application process before the conditional MSc offer is issued. Only shortlisted applicants will be asked to mail the hardcopies of supporting documents to the Division after the conditional offer is issued. All documents submitted will not be returned.

Mailing Address for Submitting application materials (for shortlisted applicant only):

Division of Electronic Engineering (MSc in Microelectronics and Integrated Circuits)
Room 404, Ho Sin Hang Engineering Building,
The Chinese University of Hong Kong,
Shatin, NT, Hong Kong SAR,
P.R. China

** Please always quote the Application No. in the future correspondences.


Application Result

Applicants may login the Application for Admission to Postgraduate Programmes and check your application results in the section of "View Application Result".

An official admission offer letter must be issued only by the department or the graduate school. Applicants who do not receive notification by early September can assume their applications have been unsuccessful. No written notification will be sent to unsuccessful applicants.


Enquires:

Address : Division of Electronic Engineering (MSc in Microelectronics and Integrated Circuits)
Room 404, Ho Sin Hang Engineering Building,
The Chinese University of Hong Kong, Shatin, NT, Hong Kong
Tel : (852) 3943 8249
Fax : (852) 2603 5558
Website : http://www.ee.cuhk.edu.hk/
Email : Email住址會使用灌水程式保護機制。你需要啟動Javascript才能觀看它
Office Hours : Monday to Thursday 8:45 a.m. - 5:30 p.m.
Friday 8:45 a.m. - 5:45 p.m.

 

  • A student must take and pass 8 courses, including 3 required courses in this programme with a GPA of 2.0 or above to graduate.
  • A student will be discontinued from study if the student has a GPA below 1.0 or fails to have probation lifted after being put on academic probation for two consecutive terms of attendance (probation threshold below 2.0).
  • The length of study is usually 1 academic year in full-time mode and 2 academic years in part-time mode. Each year has 2 terms.
  • Subject to the approval of the Programme Directors concerned, students can take at most two courses from other M.Sc. Programmes within the Faculty of Engineering.
  • Full-time mode students are allowed to take other day time postgraduate courses offered by the Department of Electronic Engineering.
  • Students may apply for course and unit exemption for a maximum of 2 courses (6 units) subject to the approval of the Programme Director and the Dean of the Graduate School on a case-by-case basis, taking into account individual circumstances.

Award of Degree

Graduates will receive a Master of Science Degree in Microelectronics and Integrated Circuits from The Chinese University of Hong Kong if satisfy the credit unit and GPA requirement.

Each M.Sc. student required to complete a minimum of 24 units of courses, including 9 units of required courses. Subject to the approval of the Programme Directors concerned, students can take at most two courses from other M.Sc. Programmes within the Faculty of Engineering. Full-time mode students are allowed to take other day time postgraduate courses offered by the Department of Electronic Engineering. Students may apply for course and unit exemption for a maximum of 2 courses (6 units) subject to the approval of the Programme Director and the Dean of the Graduate School on a case-by-case basis, taking into account individual circumstances.

The following table lists the M.Sc. courses in Microelectronics and Integrated Circuits.

Course List

Course Code Course Title Unit
ICMS5711 Design and Analysis of Analog ICs in Advanced CMOS Technologies* 3
ICMS5712 Digital Signal Processing IC Design* 3
ICMS5713 Smart Power IC Design* 3
ICMS5721 Advanced Semiconductor Packaging 3
ICMS5722 Advanced RF Circuit Design and Systems 3
ICMS5723 CMOS RF IC Design 3
ICMS5724 Embodied Intelligent Electronics 3
ICMS5725 Emerging Neuromorphic Electronics 3
ICMS5726 Fundamental Digital VLSI Circuit Design 3
ICMS5727 Mixed-signal Integrated Circuit Design 3
ICMS5728 RISC-V Integrated Circuit 3
ICMS5802 Research and Development Project 3
ICMS5902 Microelectronics and Integrated Circuits Internship 3
ELEG5764 Artificial Intelligence IC Design 3
ELEG5765 Fundamentals of Automotive Integrated Circuits 3

*Required course

Upon completion of this program, many students had been joined various well-known companies such as China Mobile, HUAWEI, Alibaba, ASM, ASTRI, Xeno Dynamics, Nuvoton, Maxim Integrated. Meanwhile, some students have continued to pursue PhD studies at CUHK or other universities.

 

Employers / Company of Recent Graduates

Commerce and Industry

Universities/ Educational Institutions 公司中文名称
China Mobile Communications Group Co., Ltd. 中國移動通信集團有限公司
Huawei Technologies Co., Ltd. 華為技術有限公司
ASM Pacific Technology Hong Kong Ltd ASM 太平洋科技(香港)有限公司
Hong Kong Applied Science and Technology Research Institute Company Limited (ASTRI) 香港應用科技研究院有限公司
ByteDance Ltd. 字節跳動有限公司
ChangXin Memory Technologies 長鑫存儲有限公司
China Merchants Bank 招商銀行股份有限公司
Hangzhou Hikvision Digital Technology Co., Ltd. 杭州海康威視數字技術股份有限公司
JD.com, Inc. 京東集團
Shenzhen DJI Technology Co., Ltd 大疆創新科技有限公司
UnionPay International Co., Ltd. 中國銀聯股份有限公司
Vivo Communication Technology Co. Ltd 維沃移動通信有限公司
AIA Group Limited 友邦保險
Alibaba Group Holding Limited 阿里巴巴集團
Anker Innovations Co., Ltd 安克創新
APT Satellite Holdings Limited 亞太衛星控股有限公司
Asia Satellite Telecommunications Company Limited 亞洲衛星通信有限公司
Atspin Limited -
AUX Group Co., Ltd. 奧克斯集團有限公司
Aviation Industry Corporation of China, Ltd. 中航工業集團
Bank of Ningbo Co., Ltd 寧波銀行股份有限公司
BASSETTI China 上海巴施帝信息科技有限公司
Beijing Bewinner Communications Co., Ltd 北京北緯通信科技股份有限公司
BOE Technology Group Co., Ltd. 京東方科技集團股份有限公司
C&B Eureka Innovations Pte Ltd. 深圳市開步電子有限公司
China Great Wall Securities Co Ltd 長城證券股份有限公司
China Southern Airlines Company Limited 中國南方航空股份有限公司
China Telecom Corp., Ltd. 中國電信股份有限公司
China United Network Communications Group Co., Ltd. 中國聯合網絡通信集團有限公司
Continental Conair Ltd. -
Ernst & Young Global Limited 安永會計師事務所
Evertop Technology (Hong Kong) Co., Ltd. 恆正科技(香港)有限公司
GRACS Ltd -
Guangzhou Easefun Information Technology Co.,ltd. 廣州易方信息科技有限公司(保利威)
Hainan Meilan International Airport Company Limited 海南美蘭國際機場股份有限公司
Haitong Securities Company Limited 海通證券股份有限公司
Hewlett-Packard Hong Kong Limited 惠普香港有限公司
Hong Kong Telecommunications (HKT) Limited 香港電訊有限公司
Inova Automation Co., Ltd. 匯川技術(香港)有限公司
International Business Machines Corporation 國際商業機器股份有限公司
Kinetic Technologies HK Limited 香港商芯凱電子科技股份有限公司
KPMG International Limited 畢馬威會計師事務所
Lenovo Group Ltd 聯想集團有限公司
Lianmeng Technology Shenzhen Co Ltd 深圳市臉萌科技有限公司
LR Construction Technologies Ltd. 創新建築科技有限公司
Manufacturers Life Insurance Company 宏利金融股份有限公司
Maxim Integrated Products, Inc. 美信集成產品
Meituan 美團
Mihoyo., Co., Ltd 上海米哈遊網絡科技股份有限公司
Minsheng Banking Co. Ltd 中國民生銀行
M-MOS SEMICONDUCTOR HONG KONG LIMITED 香港商莫斯飛特半導體股份有限公司
murata manufacturing co. ltd. 村田製作所
NetEase, Inc. 網易股份有限公司
Netgear, Inc. 網件股份有限公司
PCCW Solutions Limited 電訊盈科企業方案有限公司
PingAn Tec, Co.Ltd. 平安科技有限公司
Po Leung Kuk 保良局
SAE Magnetics (H.K.) LTD. 香港新科實業有限公司
SAP (China) Co., Ltd. 思愛普中國有限公司
SenseTime Group Limited 商湯科技有限公司
Sf Technology Co., Ltd. 順豐科技有限公司
Shenzhen Clou Electronics Co.,Ltd. 深圳市科陸電子科技股份有限公司
South China National Centre of Metrology 廣東省計量科學研究院
Suffice Industrial Technology Co. Ltd 適發工業科技有限公司
Thales Transport & Security (Hong Kong) Ltd 泰雷茲 (香港) 有限公司
The Bank of China 中國銀行股份有限公司
The China Quality Certification Cente 中國質量認證中心
The State Grid Corporation of China 國家電網公司
Theia. Lighting Solution.Co. -
Tyco Intergrated Fire & Security Co. Ltd -
UL International Limited UL安全檢定國際有限公司
Wintel Software Limited 香港雲杰軟件開發有限公司
Zhejiang Dahua Technology Co., Ltd. 浙江大華科技股份有限公司
Zhejiang Province Institute of Architectural Design and Research 浙江省建築設計研究院
Zhongxing Telecommunication Equipment Corporation 中興通訊股份有限公司
Zmodo Technology Corporation, Ltd 深圳市智美達科技股份有限公司

 

Education

Universities/ Educational Institutions 公司中文名称
The Chinese University of Hong Kong 香港中文大學
Southern University of Science and Technology 南方科技大學
City University of Hong Kong 香港城市大學
Poly University of Hong Kong 香港理工大學
The University of Hong Kong 香港大學
Sichuan Tianfu Newarea Third School 四川天府新區第三中學
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