Objective

This course is designed for students to gain an in-depth understanding in semiconductor processing and the related technical issues. Through this course, students will learn the essentials of the unit process steps in semiconductor device fabrication and how different devices and integrated circuits as well as functional systems are fabricated. Also they will have an appropriate exposure to modern CMOS process flow and integration issues. They will be introduced to the impact of processing on device electrical performance. They will have basic understanding of the SUPREM IV process simulator. Recent advances in selected topics will also be discussed.

Syllabus

• Modem IC fabrication of CMOS and bipolar transistors
• Process engineering for VLSI fabrication: photolithography, plasma etching, ion implantation, chemical vapour deposition, epitaxy, oxidation , diffusion and metallization
• Process simulations
• Reliability, yield and packaging of IC's

Learning Outcome

By the end of the course, students should be able to

• Have an overall picture of the history, progress, and importance of semiconductor device fabrication techniques, and understand their advantages and limitations.
• Understand the physical principles and technologies of different types of the unit processes applied in an electric/photonic circuit and/or system, including p-n diodes, CMOS transistors, SOI based transistors, etc.
• Have hands-on experience to fabricate simple p-n diodes, Schottky diodes, ohmic contact, or MOS capacitors
• Understand different fabrication technologies used in contemporary semiconductor industry.
• Properly handle MOS capacitors and perform simple quality evaluation by C-V measurement.

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